Semilab is proud to release the Semilab WG product line, a wafer geometry monitoring metrology solution ready to meet the needs of wafer and device manufacturers to identify dimensional specifications of silicon samples.   

Semilab wafer geometry monitoring systems are using capacitive sensors – a non-contact electrical method - resulting in high accuracy and reproducibility. Capacitive distance sensor is used due to its reduced sensitivity to any surface variation. 

WG systems measure wafer geometry of substrates with different surface conditions like sliced, lapped and etched, that is the most suitable solution for a process control in a wafering phase of substrate manufacturing.

The metrology systems provide Thickness and Bow/Warp measurement, Total Thickness Variation (TTV) monitoring and Flatness calculation, with optional Non-Contact Resistivity measurement and Film Stress characterization for IC manufacturers.

To answer different manufacturer needs regarding sample size and loading option, the WG system is available in 3 different platform variations: WG-2201, WG-2202 and WG-2500.

Contact us to learn more and find the right configuration and elevate your manufacturing processes now.