The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) will be held between September 9^th  – 11^th 2026 in Helsinki’s Finlandia Hall. As the  premier international event in the field of electronics packaging and system integration, ESTC brings all the experts together.

Semilab is proud to be a part of the event’s scrientific program as well, as Attila Sütő, uSE & OCD Product Development Team Leader of Semilab, will deliver a poster on "Snapshot Ellipsometry for Advanced Packaging".

Make sure to catch his poster in Poster Session B, between 10:15am – 11:am on Thursday, 10^th September 2026, and visit him later at the Semilab booth to discuss the topic further as well.

Register HERE!