WG-2202

Semilab wafer geometry monitoring systems are using capacitive sensors – a non-contact electrical method - resulting in high accuracy and reproducibility. Capacitive distance sensor is used due to its reduced sensitivity to any surface variation. 

WG systems measure wafer geometry of substrates with different surface conditions like sliced, lapped and etched, that is the most suitable solution for a process control in a wafering phase of substrate manufacturing.

The WG-2202 is ideal for 200 mm sized wafers and SMIF loadport loading.

Applications:

• Thickness measurement
• Total Thickness Variation (TTV) monitoring
• Bow/Warp measurement
• Flatness calculation

Options:

• Non-contact Resistivity measurement
• Film stress characterization for IC manufacturers