Within the Advanced Packaging market, metrology and quality control play a critical role in ensuring stable processes high reliability and consistently high yield. This is particularly important for hybrid bonding where surface cleanliness, planarity alignment, accuracy and precise process control are essential to achieving the required product quality.

Demand for these technologies is growing rapidly while production capacities are operating at full utilization and both material resources and the utilities required for manufacturing, such as electricity and water, are increasingly limited. In this environment any undetected defect can result in significant costs and capacity losses which makes maintaining a high yield one of the most crucial factors in production.

Semilab metrology and quality control solutions were designed to identify critical defects at early stages of manufacturing, thus optimizing manufacturing processes and maximizing yield in Hybrid Bonding production.