SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently, bringing together top players in the semiconductor packaging and PCB mounting fields.

Come and meet Semilab as we will be among the exhibitors of the conference during 14-16 December as well.

Registration: https://www.semiconjapan.org/en/about/pricing-and-register