AFM-3000
AFM-3000 is the newest addition to the Semilab AFM family, offering a fully automated solution for 3D nano-imaging and defect inspection of wafers. This robust machine adheres to industrial standards for micro and nano-topology measurements and features a modern platform.
The Semilab AFM-3000 system is designed for various applications, including:
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Particle Inspection:
- Precise defect localization using the light scattering method (μPIT) based on imported KLARF files.
- Defect inspection using a high-resolution AFM scanner.
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CMP Process Control:
- Consistent and highly reproducible roughness characterization for quality control of semiconductor wafers up to 12" (300 mm).
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Critical Dimension AFM:
- Provides detailed 3D sample surface information on micro and nano scales.
- Suitable for silicon and non-silicon wafers, thin films, and surfaces with nanotopography.
Key Features:
- Provides high-resolution, sub-atomic precision measurements with extremely low noise levels.
- Ensures stable and accurate performance in a customizable, user-friendly environment.
- Offers vibration isolation and supports variable cantilever types with outstanding scan rates.
- Equipped with a wafer contour meter for repeatable and precise alignment.
- Includes a full wafer AFM profilometer mode.
- Optional features such as
- defect review capability, combining high-resolution AFM measurement with micro-particle inspection metrology (µPIT) for immediate defect determination.
- pattern recognition,
- cantilever exchange with tip qualification (up to 10,000 tip exchanges without failure), and
- environmental control module.
- Offers flexibility with AFM tip scanner setup for a wide scanning range.
- Accommodates sample sizes up to 300 mm.
The AFM-3000 is ideal for various industry quality control applications, including:
- Wafer makers and device makers in the semiconductor industry for quality inspection.
- Roughness measurement of samples after CMP (Chemical Mechanical Polishing).
- Defect inspection and localization.
- Research centers involved in nano-imaging and defect inspection.