The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The 10th IEEE ESTC will be taking place between 11-13^th September 2024, in Berlin, Germany.

Semilab is attending the event alongside our valued cooperation partner Fraunhofer, to highlight the strength of our partnership and the collaborative work we’ve been doing.

Experts of Semilab are also preparing poster presentations to introduce you to their latest results:

• György Nádudvari, Division Manager of the Optical Measurement Technologies Division will talk about the ,,Infrared Optical Solutions for Void Inspection of bonded wafers and Bonding overlay control” starting at 5pm on  Wednesday, 11^th September 2024 in the Poster Session 1,
• while Attila Sütő, R&D team leader of Use & OCD Product Development in the Ellipsometry Department will present his results on ,,Monitoring Cu via structures and surrounding dielectric stack after CMP process” starting 10:30am on Friday, 13^th September 2024, in the Poster Session 3.

Register HERE