FAaST 330/230 C-V / I-V

FAaST 330/230 C-V / I-V systems apply Semilab SDI’s advanced C-V / I-V measurements based on patented corona-Kelvin methods to provide non-contact imaging of dielectric and interface properties on monitor wafers. These platforms include automated wafer handling that is suitable for the medium to high-volume manufacturing environment.  These models feature:

• Automatic robotic wafer handling
• Single open-cassette wafer loading station; with configurable options including SMIF / FOUP Loadport / Versaport
• Full wafer NVD inspection and Plasma Damage Monitoring using Surface Voltage FAST Mapping mode
• Automatic programmable sites or contour mapping of dielectric properties including:
  • Dielectric Capacitance (C_D) and Thickness (EOT)
  • Dielectric Leakage Current (I-V)
  • Flatband Voltage (V_fb)
  • Interface Trap Density (D_it)
  • Interface Trapped Charge (Q_it)
  • Semiconductor Surface Barrier (V_sb)
  • Oxide Total Charge (Q_tot)
  • Mobile Ionic Charge (Q_m), among others
• FAaST software package; including Measurement, Recipe Writing and Data Viewing applications
• Suitable for measurement on: semiconductors (e.g. Si, SiGe, InGaAs, SiC, GaN) with high-k and low-k dielectric films (e.g. SiO₂, SiN_x, Al₂O₃, HfO₂ ; mixed dielectrics and dielectric film stacks)
• Configurable for 100mmto 300mm wafers, with options available to accommodate multiple wafer sizes and to allow for manual load of smaller wafer diameters
• Line Conditioner with flexible compatibility
• Compatible for configuration with other Semilab SDI FAaST tool measurement technologies
• Additional available options include: Mini-environment, 300mm Semi compliant Automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader, 1000V V_cpd measurement range