FAaST 300-SL
The FAaST 300 SL system is the cutting-edge non-contact electrical metrology system that combines both of Semilab SDI’s patented Micro and Macro corona-Kelvin methods into a single platform designed to support advanced R&D as well as the most demanding high-volume manufacturing environment.
Features and System specifications:
- Automatic robotic wafer handling
- Dual FOUP Loadport; optional configuration with single Loadport or including Versaport
- Suitable for patterned wafer (Micro) and monitor wafer (Macro) measurements
- Semilab SDI patented high resolution (10µm) Micro corona-Kelvin based on Kelvin Probe Force Microscopy (KPFM) for measurement of dielectric and interface properties in Scribe Line test sites (down to 40µm x 40µm) and active device regions
- Advanced 2 step Non-Visual Defect (NVD) Inspection that combines full wafer Macro surface voltage imaging and focused high resolution intra-die surface voltage imaging using KPFM
- Automatic programmable sites or contour mapping of dielectric properties including:
- Dielectric Capacitance (CD) and Thickness (EOT),
- Dielectric Leakage Current (I-V)
- Flatband Voltage (Vfb),
- Interface Trap Density (Dit),
- Interface Trapped Charge (Qit),
- Semiconductor Surface Barrier (Vsb),
- Oxide Total Charge (Qtot),
- Mobile Ionic Charge (Qm), among others
- FAaST software package; including Measurement, Recipe Writing and Data Viewing applications
- Suitable for measurement on: semiconductors (e.g. Si, SiGe, InGaAs, SiC, GaN) with high-k and low-k dielectric films (e.g. SiO2, SiNx, Al2O3, HfO2 ; mixed dielectrics and dielectric film stacks)
- Default configuration for 300mm wafers; with option for 200mm/300mm bridge configuration
- Line Conditioner with flexible compatibility
- Compatible for configuration with other Semilab SDI FAaST tool measurement technologies
- Additional available options include: Mini-environment, 300mm Semi compliant Automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader, 1000V Vcpd measurement range