The best quality control can be achieved by inline process monitoring to check every wafer in the manufacturing process. However, in some cases the short cycle time (usually less than 1 second) does not allow to realize detailed analysis of the wafer, which may include full wafer mapping and techniques requires mechanical contacts.

The measurement tools were designed to include non-destructive techniques and favor non-contact methods where possible.

• Fast measurements
• User friendly operation
• Low cost of ownership

The applications include the followings:

• Incoming wafer characterization
• Measurement of electrical parameters in different manufacturing steps
• Characterization of deposited layer parameters
• Monitoring surface passivation efficiency and homogeneity