New product release: MBM-2201 mobility and sheet resistance measurement system for RF GaN market
03.31.2022
We are pleased to present Semilab’s new metrology system: MBM-2201 mobility and sheet resistance measurement system.
MBM series provide results for compound semiconductor device manufacturers having critical need to know the uniformity of mobility and resistivity.
MBM-2201 is a non-contact and non-destructive system for the characterization of charge carrier mobility and sheet resistance of compound semiconductors with high resistivity substrates on the entire surface up to 200 mm sample sizes.
Technology background
Based on the growing market demand in the semiconductor industry, developing a contactless metrology for compound semiconductor characterization has of an utmost importance.
It is a non-contact and non-destructive measurement method thus sample wafers can be sold after measurements. The MBM system is capable of factory automation fulfilling industrial standards by fully-automated wafer handling capability and SAM2™ (Semilab Automation Manager 2) based software.
Applications
MBM system is capable of the following applications:
Benefits
MBM-2201 as a non-contact and non-destructive measurement system, fulfills industrial standards with its modern platform:
- Small footprint, ISO Class 1 cleanroom design
- Factory automation: fully-automated wafer handling capability
- 3” wafers: in manual mode; 4”-6”, 8” wafers: automatically
- Improved performance compared to predessedor system:
- High sampling frequency and throughput
- Improved stability
- Wider sheet resistance and mobility ranges
- SAM2 based user-friendly interface is used compliant to SEMI® standards (E5-0813; E30-0611; E37-0413; E37.1-1109)
For more information download MBM-2201 brochure or send your product related questions to our colleagues via our Contact Form.