RT-2201, RT-2500, RT-3000 Sheet Resistance Metrology Systems
Semilab’s new generation sheet resistance measurement systems combine four-point probe (4PP) with non-contact measurement techniques in a variety of platforms from the cost-effective, low automation platform (WT) to full SEMI standard compliant platforms (RT). In addition to the more conventional 4PP, non-contact measurement can be applied to BEOL (metal layers thickness) using EDDY or to FEOL (implant monitoring) using JPV.
Features and System specifications:
- Wafer handling: Robot up to 300 mm
- Inspected area: Full sheet wafers
- Probes: 4PP (FEOL & BEOL) , EDDY (BEOL) , JPV (FEOL)
- 1-4 permanent 4PP heads for different ranges & applications, Lower CoO
- Cleanroom class: class 1 minienvironment
| Specification | RT-2201 | RT-2500 | RT-3000 |
|---|---|---|---|
| Wafer Size | up to 200 mm | 150/200 mm or 200/300 mm | 200/300 mm |
| Loading options | 2 open cassettes up to 200 mm |
|
Double FOUP platform |
| Automation software | SECS/GEM communication option | SECS/GEM communication option | Fully automated software |
| Factory automation |
Not available |
Not available, designed for mid-range fabs | Yes, specifically designed for high volume facilities with full factory automation, OHT option |
It is possible to integrate all of the following measurement techniques into one mapping instrument:
- Eddy current technique for thin layers' sheet resistance measurements
- Junction Photovoltage measurement for sheet resistance mapping
- Ion Implant Monitoring
RT product line is designed to meet SEMI standards.
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