FAaST 330/230 DSPV

The FAaST 330/230 DSPV systems are designed to provide world-leading, non-contact fast in-line monitoring of heavy metal contamination, including sub 10⁸ atoms/cm^-3 Fe detection, with automated wafer handling that is suitable for the medium to high-volume manufacturing environment.

Features and System specifications:

• Automatic robotic wafer handling
• Single open-cassette wafer loading station with configurable options including SMIF / FOUP Loadport / Versaport
• Automatic full wafer FAST mapping of diffusion length, Iron, and Other Recombination Centers (Nr)
• Option for advanced digital SPV functions, including Backsurface Recombination (S_b), Steady State Diffusion Length (L₀), and Copper measurements
• FAaST software package, including measurement, recipe writing and data viewing applications
• Configurable for 100 mm to 300 mm wafers, with options available for multiple wafer size
• Line conditioner with flexible compatibility
• Compatible for configuration with other Semilab SDI FAaST tool measurement technologies
• Additional available options include: Minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, 300 mm Semi-compliant automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader