En-Vision-3000

En-Vision is an essential system for early detection of process-induced dislocations in FEOL, speed-up learning curve for new product / development additionally in-line alternative to chemical etching and X-TEM.

Features and System Specifications:

• Inspected area:
  • Product wafers
    • Measurement boxes
    • In device
  • Blanket and monitoring wafers
• Defects being detected: Buried extended defects (Dislocations, Oi precipitates, COP, Stacking faults and so on)
• Detection limit based on BMD detection of Oi precipitate defects
• Data Acquisition:  
  • Image segmentation (measurement box and device area)
  • Die to die inspection
  • Image stitching (larger FOV)
• Data Analysis: 
  • Statistical tools
  • Defect classification
  • Batch / Lot Reprocessing
• Data Output: SECS GEM, KLARF, Export