WT-2200, WT-2500, WT-3000
WT series are powerful stand-alone tools specifically designed for high volume 300 mm facilities with full factory automation and OHT included.
Features and System Specifications:
- Wafer handling: Robot up to 300 mm
- Cleanroom class: class 1 minienvironment
- Treatments:
- Hot chuck / desorber
- Linear corona charger and pin charger
- Optical flash
- High temperature RTP
| Specification | WT-2200 | WT-2500 | WT-3000 |
|---|---|---|---|
| Wafer Size | up to 200 mm | 150/200 mm or 200/300 mm | 200/300 mm |
| Loading options | up to 4 pieces of 200 mm open cassette |
|
Double FOUP platform |
| Automation software |
SECS/GEM communication option |
SECS/GEM communication option | Fully automated software |
| Factory automation | Not available, designed for mid-range fabs | Not available, designed for mid-range fabs | Yes, specifically designed for high volume facilities with full factory automation, OHT option |
It is possible to integrate all of the following measurement techniques into one mapping instrument:
- Microwave induced photoconductive decay
- (µ-PCD) and Charge-PCD / minority carrier lifetime mapping
- Surface Photovoltage (SPV) / diffusion length mapping
- Iron (Fe) concentration mapping
WT product line is designed to meet SEMI standards.
Request Info