The FAaST 310/210 SPV systems provide fast, full wafer contamination imaging in a design suitable for R&D and low-volume manufacturing environments.

Features and System specifications:

Manual wafer loading, including cassette placement station and vacuum wand
Automatic full wafer FAST mapping of diffusion length, Iron, and Other Recombination Centers (Nr)
FAaST software package, including measurement, recipe writing and data viewing applications
Configurable for 50 mm to 300 mm wafers, with options available for multiple wafer sizes
Step down power transformer with flexible compatibility
Additional available options include: Automatic data upload and/or data export, Seismic brackets

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