Application
SI WAFER SORTING
Sorter applications provide advanced multiparameter wafer inspection with integrated high speed sorting for quality control of production PV wafers. Owing to wide range automation module portfolio and flexible combined Semilab’s metrology modules, all customer can find perfect configuration what fulfil their production expectations.
Application area:
- Outgoing wafer inspection for wafer manufacturers
- Incoming as-cut wafer inspection for solar cell manufacturers
Sorter purpose
- Eliminating damaged wafers from further process
- Eliminating high thickness variation wafers (TTV, saw mark)
- Sorting of potentially weak wafers (microcracks) which could break in subsequent process steps
- Sorting based on resistivity, and lifetime values
- Sorting of wafers with dislocations, high contamination and vacancy density
- Wafer input: loading from cassettes or stack
- Wafer output: Sorting in different user-defined classes, collection in coin stacks
- High throughput
Technology
SURFACE-CONTAMINATION AND CHIPPING INSPECTION
The WSI module is an Imaging and image processing system, which can inspect the following defects:
- Contamination (length, width, area and count of the defects)
- Chipping (length, width, area and count of the defects)
- Edge-defect (length, width, area and count of the defects)
- Grain density
- Largest single- and micro-grain area
- Total single- and micro-grain area
Theory of WSI imaging: On-the-fly process where the wafer passes through between the line cameras and different type of illuminations. The system is using two illuminating systems on each side.
- Diffuse lighting for stain detection
- Focused lighting for chipping and edge-defect detection and for micro-grain and single-grain area measurement
Contamination example
Contamination example
Chipping example
Edge-defect example
Grain density example
Grain density example
FEATURES
- Diffuse lighting for contamination and stain detection
- Focused lighting for chipping and edge-defect detection
- Focused lighting for micro-grain and single-grain area measurement
- Line cameras take the pictures in four components
- Edge detection of the wafers
- Investigation of the wafer along the edges to detect bright spots for chippings and dark spots for edge-defects of the wafers
- Defect selection based on the size criteria
- Central region investigation for dark spots (contaminations)
- Blob search to merge the spots
Product Line
PVS
The PVS product line provides advanced multi-parameter wafer inspection with integrated high speed sorting for quality control of production wafers. It eliminates imperfect substrates, maximize cell line output and ensures optimized efficiency.
It combines high reliability wafer handling with Semilab’s industry leading PV metrology, to provide a turnkey solution for sorting of incoming wafers. This is backed by direct expert support from the OEM metrology manufacturer, through our worldwide network of branch offices.
Products
PVS-6000
PVS-6000 is a High Speed, field proven PV Wafer Inspection and Sorting System with 5400 wafer per hour throughput. It combines high reliability wafer handling with Semilab’s industry leading PV metrology, to provide a turnkey solution for sorting of incoming wafers. This is backed by direct expert support from the OEM metrology manufacturer, through our worldwide network of branch offices.
Loaders:
- PVLS-5400 Automated stack loader with 3 position pick-and-place system. Up to 2400 pcs buffered wafer in 12 pcs carrier.
- PVLC-3600 Automated cassette loaders for 25/50/100 slot cassettes
- PVLC-3600-AL Fully automated production line loader for 100 slot cassettes
Metrologies:
- PLI-101/3 Photoluminescence imaging
- WML-1 Minority carrier lifetime measurement
- SHP-200 2D measurement
- MCI-150 Micro crack inspection
- WSI-120 Surface chipping and contamination inspection
- TTR-300 Thickness, resistivity measurement
- TTR-300 Sawmark Inspection
Unloaders:
- PVULS-5406T High speed stack unloader with 6 bin
- PVULS-5407T High speed multilevel stack unloader with 7 bin